z/OS V2.4 and higher is supported on IBM z17. Use SMP/E FIXCATs to find the necessary service.
z/OS Sysplex requirements for coexistence is z15, z16, and z17.
Exploitation for z17 in z/OS includes: Workload level sustainability and power consumption, Workfload classification pricing, new CL6 link technology, BCPii and HMC hardened security, CF Level 26, and more.
z/OS 3.2 will IPL on z15 and higher servers. Planned GA is 3Q2025.
Some new functions previewed, but stay tuned for further announcements with more complete functions.
Highlights: new REST APIs for doing installation of service updates, support for direct encryption to tape, new z/OSMF Storage Management interface, RACF certificate support for multiple altnames, and more.
Performance - IBM z17 highlights
Telum 2 processor has the 2nd generation on-chip AI accelerator, with 8-bit integer (INT8) and 16-bit floating point (FP16) datatypes for more thruput.
5nm (from 7nm), with clock speeed of 5.5 GHz (from 5.2).
DPU has 4 port cards (from 2), with energy consumption reduction. DPU accessible from other chips and DCMs.
1 to 4 processor drawers. 4-drawer models are Max183 and Max 208.
Memory 64 TB (from 40).
Measurements with new Channel Measurement Groups 4 and 5, with SMF 73 support.
Topics
Martin and Marna discuss how they prepared materials for IBM z17, with the Upgrade Workflow and Redbooks.