Episode 36 "Telum Like It Is"

Episode 36 "Telum Like It Is"

Released Tuesday, 8th April 2025
Good episode? Give it some love!
Episode 36 "Telum Like It Is"

Episode 36 "Telum Like It Is"

Episode 36 "Telum Like It Is"

Episode 36 "Telum Like It Is"

Tuesday, 8th April 2025
Good episode? Give it some love!
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Episode 36 "Telum Like It Is"

What’s New

Mainframe - Position z/OS for IBM z17

  • z/OS V2.4 and higher is supported on IBM z17. Use SMP/E FIXCATs to find the necessary service.
  • z/OS Sysplex requirements for coexistence is z15, z16, and z17.
  • Exploitation for z17 in z/OS includes: Workload level sustainability and power consumption, Workfload classification pricing, new CL6 link technology, BCPii and HMC hardened security, CF Level 26, and more.

Mainframe Also - Preview of z/OS 3.2

  • z/OS 3.2 will IPL on z15 and higher servers. Planned GA is 3Q2025.
  • Some new functions previewed, but stay tuned for further announcements with more complete functions.
  • Highlights: new REST APIs for doing installation of service updates, support for direct encryption to tape, new z/OSMF Storage Management interface, RACF certificate support for multiple altnames, and more.

Performance - IBM z17 highlights

  • Telum 2 processor has the 2nd generation on-chip AI accelerator, with 8-bit integer (INT8) and 16-bit floating point (FP16) datatypes for more thruput.
  • 5nm (from 7nm), with clock speeed of 5.5 GHz (from 5.2).
  • DPU has 4 port cards (from 2), with energy consumption reduction. DPU accessible from other chips and DCMs.
  • 1 to 4 processor drawers. 4-drawer models are Max183 and Max 208.
  • Memory 64 TB (from 40).
  • Measurements with new Channel Measurement Groups 4 and 5, with SMF 73 support.

Topics

  • Martin and Marna discuss how they prepared materials for IBM z17, with the Upgrade Workflow and Redbooks.

On the blog

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